Термопаста
With a heat transfer coefficient of 10 W/mK, STC10 thermal compound is an effective thermal conductor for optimum cooling of electronic components.
With Zalman ZM-STC8 thermal paste, you will never be bothered by interruptions in computer operation due to overheating of its processor. The model is distinguished by a convenient packaging, so it is convenient to work with it and also comfortable to store the remains of unused material afterwards.
Thermal paste 2Е TB5-4 – is a multicomponent plastic substance with high thermal conductivity. Thermal paste is used to reduce the thermal resistance between the two contact surfaces, generally by filling the air gaps between them.
Thermal paste 2Е TB5-2 – is a multicomponent plastic substance with high thermal conductivity. Thermal paste is used to reduce the thermal resistance between the two contact surfaces, generally by filling the air gaps between them.
Thermal paste 2Е TB8-2 – is a multicomponent plastic substance with high thermal conductivity. Thermal paste is used to reduce the thermal resistance between the two contact surfaces, generally by filling the air gaps between them.